Technical Specifications

Laser System

• Laser Type: Nd:YAG laser (infrared)

• Wavelength: 1064 nm

• Average Laser Power: (varies by configuration; e.g., 20 W, 30 W, 40 W, etc.)

• Pulse Frequency: Up to 1000 kHz depending on model

• Pulse Duration: Typically 40–500 ns depending on parameters

• Laser Spot Diameter: ~20 µm (model dependent)

• Beam Quality: ≤ 1.6 M²

• Laser Guide: Class 2M red laser diode (λ = 650 nm; 2 mW)

Performance & Precision

• Maximum Marking Speed: ~2000 mm/s

• Positioning Accuracy: ± 0.05 mm

• Repeatability: ± 0.02 mm

Work Area & Motion

• Max Workpiece Size (Chamber): Up to ~700 × 400 × 390 mm (varies by configuration)

• Maximum Workpiece Weight: Up to ~100 kg

• Axis Motion (X‑Y‑Z): Three‑axis portal with motorized movement and encoder control

Software & Controls

• Control Software: Integrated Sisma SLC (handles project files and engraving parameters)

• Vision Integration: Compatible with coaxial or non‑coaxial vision systems for precise centering and positioning

Machine Dimensions & Power

• Power Supply: ~230 V ± 15%, 50/60 Hz, single phase (~1 kW)

• Dimensions (Approx): ~1172 × 1552 × 1775 mm (with monitor support)

• Weight: ~900 kg (varies by configuration)